Q: Design & Engineering

DESIGN SOFTWARE DESCRIPTION Power Logic PADS Schematic Entry Power PCB PADS Printed Circuit Board Layout CAM 350 Gerber Editor Fuji Flexa Fuji Machine Programming AutoCAD Computer Aided Drafting Solid Works Solids Modeling Cosmos Finite Element Analysis Master CAM Mill & Lathe Programming Software Metal Soft Sheet Metal Programming Software

Question 1

Surface Mount Technology

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 2

Thru-Hole PCB

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 3

Electro-Mechanical Assembly

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 4

CNC Machining

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 5

Sheet Metal Fabrication

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 6

Design & Engineering

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

Question 7

Quality Assurance

Accepted Answer

MAKE	MODEL	CAPACITY
Fuji Line #1		Max. Board Dims: 457 mm (30") x 355 mm (27") Min. Board Dims: 90 mm (3.5") x 60 mm (2.4")
Ekra	Ekra X5 Professional Large	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 128 different comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Fuji	XPF-W Chip-IC Placer	Accuracy: +/- 0.040mm Max Placing: 24,000 pts/hr. Comp.01005 - 20X20mm 74 different comps. 20 matrix tray comps.
Pyramax	98 BTU International Forced Convection Reflow Oven	Forced Convection Nitrogen or Air Atmosphere 14 Zones (7 Top, 7 Bottom) Heated Length: 98" Cooling Length: 30"
Fuji	FujiTrax System	Setup validation and info management. Component and PCB traceability.

Fuji Line #2
EKRA E5	Stencil Printer	PCB size min.: 80 x 50mm (3.2” x 2.0”) max.: 750 x 610mm (29.5” x 24”) Automatic stencil cleaning. Temperature controlled print area. 2 1/2D Post-Print Inspection System. Auto Pin guidance system for double-sided boards.
CP-743E	Chip Placer	Vision Correction Accuracy within +/- 0.066 mm. Max. Placing Rate: 0.068 sec/part 52,000 parts/hr Components from 0603mm (0201 in) to 19X19 sq.mm. 140 Different Components Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max placing rate: 6000 parts/hr. Components from 1206-size to 54mm QFPs & BGAs. 40 different components max. 20 matrix tray components max. Max board dims. 457X355mm (18"X14"). Min board dims. 90X60mm (3.5"X2.4")
CONCEPTRONIC	HVA-102	Forced Convection Heating 14 zone (7 top / 7 bottom) Heated Length: 102" Cooling Length: 30" Max board width: 20"

Fuji Line #3
Ekra E5-36		PCB size min.: 90 x 60 mm (3.5” x 2.4”) max.: 510 x 547 mm (20” x 18”) Vision Correction for 0.4mm fine pitch patterns. Automatic screen alignment Computer controlled temperature
FCP VI-5000	Chip Placer	Vision correction for accurate component placement Accuracy +/- 0.1mm Max. placing rate 0.12 sec/part (28,000 parts/hr) 140 different components max. Max. board dims. 510X457mm(20"x 18") Min. board dims. 90X60mm (3.5"x2.4")
XP-243	IC Placer	Accuracy +/- 0.066mm Max. placing rate 0.6 sec/part (6,000 parts/hr) 40 different components max. 20 matrix tray components max. Max. board dims. 457X355mm (18"x14") Min. board dims. 90X60mm (3.5"x2.4")
Conceptronic	HVN-102 Forced Convection Reflow Oven	Forced convection heating Nitrogen or Air Atmosphere 14 zone (7 top, 7 bottom) Heated length 102" Cooling length 30" Max. board width 20"

Fuji Line #4 (Large Board)
Ekra X5-36	Stencil Printer	Auto Optical Alignment Alignment accuracy of +/- 12.5um at 6 sigma Max print area of 660mm x 550mm
AMIEX IIS	Chip Placer- IC Chip Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
AMIEX IIS	Chip Placer-IC Placer	Accuracy: +/- 0.038mm Max Placing: 25,000 CPH Comps from 01005 t0 74mm x 74mm Comp height up to 25.4mm Max board dims : 774mm x 686mm
Pyramax 125BTU International	Forced Convection Reflow Oven	Forced convection nitrogen or air atmosphere. 20 zone - 10 top and 10 bottom

Selective Solder
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Versaflow 3/45	Mini-Wave and Multi-Wave 4 flux spray heads Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 5kg. Solder Module: PCB size up to 406x508mm.
ERSA	Ecoselect 2	Mini-Wave, Mini-Dip, and Area Soldering possible. Conveyor: PCB Width 63.5-508mm Length 127-508mm Max weight 8kg.

Inspection Equipment
Saki BF-3Di-Z1	Automated Optical Inspection (AOI)	3D measurement utilizing quad directional side cameras along with Saki's unique phase measurement profilometry technology provides the 3rd dimension of the Z axis. Capable of handling extra large boards of 686x870mm.
Saki BF-frontier Version 9	Automated Optical Inspection (AOI)	Camera Resolution: 18um scanning line color CCD. Lighting: LED. Board size 2x2.4 thru 18x20 in. PCB clearance: 40mm top and bottom. Inspection categories: Presence/Absence, Misalignment, Tombstone, Reverse, Polarity, Bridge, Foreign Material, Absence of Solder, Insufficient Solder, Lifted Lead, Lifted Chip and Fillet Detection.
Saki BF-Frontier II	Automated Optical Inspection (AOI)	Same as above, but Frontier II has a new color capturing system for increased scanning speeds.
Nikon/Xtek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
Nicolet	NXR-1400M X-Ray Imaging System	20-120kV 10-60W Adjustable. 360 Deg. Sample Rotation Digital and hard copy records
Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils

BGA Rework and Installation Stations
Air Vac	DRS 25, SMT-BGA Rework Station	Remove most SMT components up to 50mm sq. Install and remove micro to 50mm.sq. BGAs. Full board heating for even thermal expansion.
Hakko	FR-1418 Rework Station	Same

QUANTITY	MAKE	MODEL
	Universal	Model 6772A DIP Inserter
	Universal	Model Radial 5 Radial Inderter

Line #2	Universal	Axial Inserter Model VCD 88HT
	Universal	Radial Inserter Model 88HT
	Universal	DIP Inserter Model 6772A


1	JT Industries Wave Solder WS-450-PC-BN	Dedicated Lead-Free (RoHS) Usage
1	JT Industries Wave Solder WS-450-PC-BN	Used in Leaded Applications only.
	Trek Industries	Triton MIL IV SMT Aqueous Cleaner
4	HAKKO	485 Miniwave
	Hepco	8000-1 & 3000-2 Axial Lean Form & Cut
	Hepco	1500-1 Radial Lead Cut (only)
	Hepco	7900 LFA IC Former
	Pace Inc.	MBT 100 Desoldering Station
	Hako	907 Soldering Station
	A Corp.	001 Lead Trimmer
	A Corp.	QB1 Lead Brusher
	Ultra Sonic Inc.	Econo Flux Spray Fluxer
	Alpha Metals	SMO II Ionograph
	Simco	Deionizing Blower
	Audel	7530 Speed Fastening System
	Hart	200A Hot Air Repair Terminal
	Hart	Electric/Air Operated Tools
	Luxo	Magnifiers
	Mantis	Microscope
	Blue M	OV 12A Table Oven
	Blue M	Blue M
	Niton	XLt 797Z Multi Filter Plastic/Metal Analyzer - RoHS

QUANTITY	MAKE	MODEL	CAPACITY
	Carpenter	Model 34-2 Wire Cutter
	Amp	Pneumatic Terminator
2	Amp-O-Lectric	Model K Terminators
	Amp	Model 818380-1 Automatic Terminator
3	Molex	TM 40 Terminator
	Amp	Various Dies for Model K Terminator
	Molex	Various Dies for TM 40 Terminator
	Amp	Various Dies for Pneumatic Terminators	>
	Eubanks	Model 2700 Wire Cutter/Stripper
	Artos	Model CS-6 Wire Cutter/Stripper
		Various torque controlled hand tools
	Miscellaneous
	CM Lonestar	Overhead Crane	1 Ton
	Morris Wheeler	JIB Crane	1 Ton
	Toledo	Model 910 Digital Counting Scale

QUANTITY	MAKE	MODEL	CAPACITY
1	Chiron	DZ15W	CNC controlled machining center provides high speed manufacturing of the highest quality and with the greatest productivity for milling, countersinking, reaming, tapping and sawing. Configured with double spindles and a lightning fast basket tool changer that has 20 tool places which is highly productive due to chip to chip times as short as 1.7s
1	MAKINO	DUO43 Wire EDM
	Milling Department
2	OKK	VM4II	14,000 RPM
2	OKK	VM53R - Vertical Mill	12,000 RPM
1	OKK	VM7 III	14,000 RPM
1	OKK	KCH 500 Horizontal Mill	6,000 RPM
1	OKK	HM60 Horizontal Mill	12,000 RPM
10	Bridgeport	Series I Mills
	Lathe Department
2	Mori Seike	NLX2500SY - Horizontal Machine Center	3" bar capacity
	with IEMCA	IEMCA Vip 80 Bar Feeders
4	Hardinge	Precision Lathes
1	Femco	Denca 30 w/ Live Tooling	3" bar capacity
1	Hyundai	HIT30S Lathe	12" Chuck 36" Turning Length
2	Nakamura-Tome	WT-150
	with IEMCA	FMB Turbo 5-55 Bar Feeder
1	Lebold	Makino Lathe
	Drilling Department
1	Delta	6 Spindle Drill Press
1	Rockwell	4 Head Drill Press
6	Rockwell	Drill Presses
	Saw Department
1	AMADA	HA-250 Auto Saw
1	Kysor Johnson	Band Saw
1	Do All	Band Saw
1	Delta	10" Table Saw
2	Versa Kut	Auto Saws
1	Loadster	1 Ton Overhead Crane
	Tool Crib
4	Grinders
1	Black Diamond	Drill Sharpener
1	Samuel Machinery	End Mill Sharpener
1	Okamoto	Surface Grinder
1	K. O. Lee	Surface Grinder
1	Mohawk	Horizontal Grinder
1	Hybco	Tap Grinder
	Deburring & Metal Finishing Department
1	Rampe	Double Barrel Tumbler
1	Wheelabrator	Vibrator	10 cu. ft.
1	Sweco	Vibrator	10 cu. ft.
1	Sweco	Vibrator	6 cu. ft.
2	Trinco	Sand Blasters
1	Trinco	Dry blast Glassbeader Model 40X40/BP2
2	Timesaver	Speedbelt Sander Model 137-1 HDIV	(one for steel, one for aluminum)
1	Hannsen	300" Belt Table Strapper
2	Mattison	100" Strap Sanders
1	Mattison	138-B 207" Belt Table Strapper
1	Baldor	Wheel Polisher
1	Baldor	Buffing Machine
1	Bader	Belt Sander Model 1004A
	Miscellaneous
1		Hydraulic Arbor Press
1	Keck	Bevel-Mill
1	Nova	Tumbler
2	Morrison	Broach Machines
1	Coolant Wizard	Coolant System
		Silkscreening Rubber Stamping w/epoxy inks Label Making equipment

QTY	MAKE	MODEL	CAPACITY
	Shears
1	Amada	Model M-1260	Cut Length = 48" Max. Thickness = 0.250"
1	Amada	Model H-4065	Cut Length = 157.5" Max. Thickness = 0.260"
1	Di-Acro	Power Shear No. 36	Cut Length = 37.750"
	Turret Punch Presses
1	Amada	Coma 567	50 Tons
1	Amada	Vipros 568	50 Tons
1	Amada	Vipros 358	30 Tons
	Laser Cutting System
1	Amada	Model FLCAJ 4020 w/auto load and unload	4000 watt Max cut area of 157.84" x 78.7" Max material thickness - 0.875" 2.4 G acceleration
1	Amada	FO-3015NT	4000 Watt
	Presses
1	Pacific	Model 250 PF-OBS	250 Tons
1	Warco	Press 100-2-500
1	Bliss	C-45	45 Tons
1	Strippit	Super 30 Model 62000
	Brakes
1	Cincinnati	210X2 Press Brake	22'
1	Chicago	Size 510-0-0 SP	250" x 10'
1	Niagra
2	Di-Acro	Hydro-Power Pressbrake No. 14-48-1
1	Amada	HFE 220-4S	242 TON 7 Axis Brake 168" Bend Length
1	Amada	Model RG-35S	35 Tons Table Length = 48"
3	Amada	Model FABIII-1030	110 Tons Table Length = 118"
1	Amada	Model FABIII-8025	88 Tons 92"
1	Amada	Model FABIII-1253	138 Tons 118”
1	Di-Acro	Finger Brake No. 24
	Hardware
1	Pem-Serter	Automated Press	5 Tons
1	Haeger	Model AF-CH
1	Balltec	Model RN180
	Spotwelders
1	Sciaky	SC1AKY 200KVA
1	Amada	ID40ST 90KVA
	Welding Department
2	Syncrowave	300	TIG
1	Miller	Model 330A/BP	MIG
2	Miller	Model CP-250TS	MIG
1	Motoman	Robotic welder Type YR-K10-C000	Steel & Aluminum
1	Motoman	Robotic welder MA1900	Steel & Aluminum
	Notchers
1	Amada	CSHW-220
1	Amada	CSW-250
1	Di-Acro	Notcher No. 1
	Hand Presses
1	Rotex	Model 18-B
1	Whitney-Jensen	Model 118
1	Whitney-Jensen	Model 218
1	Dake	Model 007
1	Di-Acro	Horn Punch No. 3
1	Excelsior	No. 15
1	Famco	Arbor Press
1	Taylor & Fenn Co.	No. 1A Spring Press
	Deburring & Metal Finishing Department
1	Rampe	Double Barrel Tumbler
1	Wheelabrator	Vibrator	10 cu. ft.
1	Sweco	Vibrator	10 cu. ft.
1	Sweco	Vibrator	6 cu. ft.
2	Trinco	Sand Blasters
1	Trinco	Dry blast Glassbeader Model 40X40/BP2
2	Timesaver	Speedbelt Sander Model 100 HDIV	(one for steel, one for aluminum)
1	Hannsen	300" Belt Table Strapper
2	Mattison	100" Strap Sanders
1	Mattison	138-B 207" Belt Table Strapper
1	Baldor	Wheel Polisher
1	Baldor	Buffing Machine
1	Bader	Belt Sander Model 1004A
	Miscellaneous
1	Schubert	Type WML23/30/630 Flattener
1	Roundo	AB Type 1P110M	50" x 3/16" MS
1	Imcar	4RH100	4 Roll Plate Roller
1	BK Taumer	70-209	Orbital Riveter
1	Fitzpatrick	Die Grinder
1	Clausing	Lathe
1	Bridgeport	Series I 2HP
1	Rockwell	Drill Press
1	Dayton	Drill Press
1	Pressrite	Model 05160 Radius

QTY	MAKE	MODEL	CAPACITY
	Electronic Inspection Equipment
1	Nikon / X-Tek	XT V 160 3-D X-Ray Inspection Station	3-D / CT Capable 5-Axis Manipulator Dual Display for simultaneous measurement and analysis
1	Nicolet	NXR-1400M X-Ray	360 Deg. Sample Rotation Digital and hard copy records
1	Niton	XLT 797Z Multi Filter Plastic/Alloy Analyzer - RoHS
	Saki Automatic Optical Inspection	BF-3Di-Z1	See SMT Section
1	SAKI - Automatic Optical Inspection	BF-FRONTIER Version 9	See SMT Section
1	SAKI -Automated Optical Inspection	BF-Frontier II	See SMT Section
3	Teradyne	Model Z1860 ATE Tester	1024 and 2048 pts
	Trace	Model 924 Bare Board Tester
1	Cyberoptics	Laser Microscope	20 Mil. Max Height differential measurement 60 Mil. max Width differential measurement 1 mW 670 nm laser diode Measurements to 0.1 mils
1	CableEye	Model M3U Cable Scanner	5 Expansion Modules Test Voltage 10V Resistance Threshold: 0.3 Ω to 10 MΩ Resistance Measurement: 1% from 100 Ω to 1 MΩ Diode Measurment: Orientation and Forward Voltage
1	CableEye	Model M2 Basic Cable Scanner	Resistance Threshold: 46 kΩ, Fixed Diode Measurement: Orientation Only Test Voltage: 5V
	General Electric	280 Volt Variac	Weston, Model #5
	ECD	Model 5100 Data Logger
3	Tektronix	Oscilloscopes: Model 2211	Roper Test, WH #D
1	Tektronix	Isolator Model A690 2B	Yes
1	Tektronix	Current Probe Amplifier Model AM 503
	Mechanical Inspection Equipment
1	Mitutoyo	Coordinate Measuring Machine	60" x 28" x 14"
	Starrett	30" Floor Standing Measuring Projector
		All standard Go/No Go thread & plug gauges and pin gauge sets
		Sets of Micrometers	0" - 1" through 12" - 13"
		Vernier Calipers	12" to 36"
		Various Height Gauges	26" to 40"
1	Vitrek	V53 Hipot Tester	QC Cage
1	Quad Tech	Sentry 20 plus AC/DC Hipot Tester

EQUIPMENT

Zober Industries, Inc. is your one-stop source for custom manufacturing: Printed Circuit Assembly, Electro-Mechanical Assembly, CNC Machining, Sheet Metal Fabrication and complete Engineering and Design.

We have state-of-the-art equipment in every one of our CAPABILITY AREAS: