| QTY.
|
MAKE |
MODEL |
CAPACITY
|
| |
Fuji
Line #1 |
|
Max. Board Dims:
457 mm (18") x
355 mm (14")
Min. Board Dims:
90 mm (3.5") x
60 mm (2.4") |
| |
Fuji |
GSP II-4000 |
Vision Correction to 0.4
mm pitch
Automatic Screen Alignment
Computer Controlled Temp. |
| |
Fuji |
FGL II-4000 |
Vision Correction
Accuracy +/- 0.15 mm
Computer Controlled Temp.
Max. Dispensing rate:
0.2 sec/part
18,000 dots/hr |
| |
Fuji |
CP-743E |
Vision Correction
Accuracy within +/- 0.066 mm
Max. Placing rate
.068 sec/part
52,900 parts/hr
Components from 0603 size to 19 x 19 mm
All Components must beJIS, EIAJ or EIA standard tape
Max. 140 Different Components |
| |
Fuji |
FIP I-4000 |
Vision Correction
Accuracy within +/- 0.10 mm
Max. Placing rate
2.8 sec/part
1,200 parts/hr
Components from 1608 size to 54 mm QFPs
Max. 35 Tape and Reel Components
Max. 10 Matrix Tray Components |
| |
CONCEPTRONIC |
Forced Convection Reflow
Oven |
Forced Convection Heating
Air Atmosphere
14 Zones (7 Top, 7 Bottom)
Heated Length: 102"
Cooling Length: 30" |
| |
Fuji
Line #2 |
|
Max. Board Dims:
510 mm (20") x
457 mm (18")
Min. Board Dims:
90 mm (3.5") x
60 mm (2.4") |
| |
Fuji |
GSP III-5000 |
Vision Correction to 0.4
mm pitch
Automatic Screen Alignment
Computer Controlled Temp. |
| |
Fuji |
FCP VI-5000 |
Vision Correction
Accuracy within +/- 0.1 mm
Max. Placing Rate:
0.12 sec/part
30,000 parts/hr
Placing Reliability: 99.99%
Components from 1005 size to SQFP48
All Components must be EIAJ or EIA standard tape
Max. 140 Different Components |
| |
Fuji |
FIP III-5000
BGA and Micro BGA |
Vision Correction
Accuracy within +/- 0.025 mm
Max. Placing Rate:
Chip
0.55 sec/part
6,500 parts/hr
IC Tape
0.5 sec/part
1,440 parts/hr
IC Tray
3.3 sec/part
1,090 parts/hr
Components from 1608 size to 74 mm QFPs
Min. Lead Pitch 0.15 mm
Max. 74 Tape and Reel Components
Max. 20 Matrix Tray Components |
| |
CONCEPTRONIC |
Forced Convection Reflow Oven |
Forced Convection Heating
Air Atmosphere/Nitrogen Atmosphere
14 Zones (7 Top, 7 Bottom)
Heated Length: 102"
Cooling Length: 30" |
| |
Fuji
Line #3
|
|
|
| |
E5XL EKRA |
Stencil Printer |
PCB size min.: 80 x 50 mm (3.2”
x 2.0”)
max.: 750 x 610 mm (29.5” x 24.0”)
Alignment repeatability 12,5 µm at 6 Sigma
Alignment accuracy 25
µm at 6 Sigma
“2 1/2D Post-Print Inspection
System”
Automatic stencil cleaning
“Auto Pin Guidance System”
for double sided boards Temperature controlled print area.
|
| |
NP-153E-XL |
Chip Placer |
Vision correction for accurate component
placement
Accuracy +/- 0.10mm (3σ) rectangular & odd form
Components from 0603 mm (0201 in) to 20 x 20 sq. mm
Max. placing rate 0.125 sec/part (28,800 parts/hr)
80 different components max.
Max. board dims. 705x587mm (27"x 23")
Min. board dims. 150x100mm (5.9"x3.9")
|
| |
NP-251-XL |
IC Placer |
Vision correction for accurate component
placement
Accuracy +/- 0.066mm (3σ) rectangular & odd form
Accuracy +/- 0.03mm (3σ) 4-side leaded
Components from 0603 mm (0201 in) to 72 x 72 sq. mm
Max. placing rate 0.3 sec/part (12,000 parts/hr)
BGA & Chip Scale (CS) BGA Placement & Inspection
(front lit ball inspection prior to placement)
40 different components max.
20 matrix tray components max.
Max. board dims. 705x587mm (27"x23")
Min. board dims. 150x100mm (5.9"x3.9") |
| |
Pyramax |
98 BTU International Forced Convection
Reflow Oven |
Forced convection heating
Nitrogen or Air Atmosphere
14 zone (7 top, 7 bottom)
Heated length 98"
Cooling length 30"
Max. board width 24" |
| |
Inspection
Equipment |
|
|
| 1 |
Nicolet |
NXR-1400M X-Ray |
360 Deg. Sample Rotation
Digital and hard copy records |
| 1 |
Cyberoptics |
Laser Microscope |
20 Mil. Max Height differential
measurement
60 Mil. max Width differential measurement
1 mW 670 nm laser diode
Measurements to 0.1 mils |
| 1 |
Niton |
XLt 797Z |
Multi Filter Plastic/Alloy Analyzer
- RoHS |
| |
Rework
Stations |
|
|
| 1 |
Air Vac |
PRS 22, SMT-BGA Rework
Station |
1206 to BGA Components
|
| 1 |
Seika |
2001 Model SS 7700
SMT Rework Station |
1206 to 240 pin QFP |
Equipment